Quantitative Modeling and Measurement of Copper Thin Film Adhesion

Quantitative Modeling and Measurement of Copper Thin Film Adhesion

Numerous mechanisms have been identified as fundamental to the adhesion of thin metallic films. The primary mechanism is the thermodynamic work of adhesion of the interface, which in its most basic description is the difference between the surface energies of the two materials and that of the interface. This quantity is often described as leveraging the contributions of other mechanisms. One of...

Copper–titanium thin film interaction

Interaction between 5 lm thick copper and 50 nm thin titanium films was investigated as a function of annealing temperature and time using MeV He Rutherford backscattering, X-ray diffraction and dynamic Secondary Ion Mass Spectrometry. Samples were made by depositing 10 nm of titanium on a PECVD silicon oxynitride, followed by 50 nm of titanium nitride and 50 nm of titanium in the said order. I...

Zinc Oxide Sputter Deposition and Modeling of Copper Indium Gallium-diselenide-based Thin Film Solar Cells

3 To my beloved parents and family 4 ACKNOWLEDGMENTS Dr. Crisalle is the chair of my supervisory committee and I express my sincere appreciation for his guidance and constant encouragement through the last five years. I am also obliged to thank Dr. Hoflund, Dr. Svoronos and Dr. Eisenstadt for their valuable discussions and serving as my research committee members. Of course my gratitude should ...

Alumina Thin Film Growth: Experiments and Modeling

architecture and engineering of nanoscale sculptured thin films and determination of their properties

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